HDI PCB - Capability

HDI PCB (High Density Interconnect Printed Circuit Board)

What are HDI PCBs?

HDI PCBs has higher circuitry density than conventional PCBs, with finer lines and spaces, smaller vias and capture pads, and higher connection pad density. HDI PCBs contain blind/buried vias and often microvias 4mil-6mil. Laser drill would be required for microvias of 4mil.

Applications

HDI PCBs are used to reduce the size and weight to make products light and thin, as well as to enhance electrical performance of the device, such as mobile phones, touch screen and 4G network communications.

Advanced Capabilities

Layer	4-24
Max. Number of Interconnected layer	4
Material	FR4 standard Tg 140C,FR4 High Tg 170C, FR4 and Rogers combined lamination
Thickness (Finished Board)	0.4mm-3.0MM
Max. Board Size	457mm*610mm
Copper Weight	0.5oz-2.0 oz
Surface Finish	HASL -Hot Air Solder Leveling Lead Free HASL - RoHS ENIG -Electroless Nickle/Immersion Gold - RoHS Immersion Silver - RoHS Immersion Tin - RoHS OSP -Organic Solderability Preservatives - RoHS
Soldermask Color	Green, red, black, yellow, white, blue, green matt, black matt
Silkscreen Legend Color	White, Black, Yellow
HDI Structures	Check the following chart
Max. Exponents of Blind/Buried Vias	stacked vias for 3 layers interconnected, staggered vias for 4 layers interconnected
Min. Tracing/Spacing	2.5mil/2.5 mil
Min. Diameter of Drill	6mil
Min. Diameter of Laser Drill	4mil
Min. Annular Ring of Drill	4mil
Min. Annular Ring of Laser Drill	3mil
Flex-Rigid combination	Yes
Via In Pad	Yes
Buried Capacitor	prototype only(The total area should be smaller than 1 Square meter)

HDI Structures

HDI Structures	Type of micorovias	Mass production	Middle/small batch	Prototype	Apply To
1+N+1	Blind vias	Yes	Yes	Yes	4 layer+
2+N+2	Blind/Buried staggered vias	Yes	Yes	Yes	6 layer+
2+N+2	Blind/Buried stacked vias	Yes	Yes	Yes	6 layer+
3+N+3	Blind/Buried staggered vias	/	Yes	Yes	8 layer+
3+N+3	Blind/Buried stacked vias	/	/	Yes	8 layer+