FR4 PCB
For standard PCB, we could meet following requirements:
Features | Capability |
Layers | 1-32 layers |
Material | FR4 standard Tg 140C, FR4 high Tg 170C |
Board Thickness | .016"-.126"(0.4mm-3.2mm) |
Copper Thickness | 1/2oz-6oz(18um-210um) |
Inner layer Copper Thickness | 0.5oz-2oz(18um-70um) |
Board size | 600x700mm |
Min Tracing/Spacing | 3mil/3mil |
Min Annular Ring | 3mil |
Min drilling Hole diameter | 0.15mm(6mil), 0.1mm(4mil)-laser drill |
Min width of cutout (NPTH) | 0.8mm |
Min width of slot hole (PTH) | 0.6mm |
Solder Mask | LPI, different colors(Green, Green matt, Black, Black Matt, White, Red, Yellow, Blue) |
Silkscreen color | White, Blue, Black, Red, Yellow |
Surface finish |
HASL -Hot Air Solder Leveling Lead Free HASL - RoHS ENIG -Electroless Nickle/Immersion Gold - RoHS(Thick of Au 1-3 u") ENIG -Electroless Nickle/Immersion Gold - RoHS(Thick of Au 3-5 u") ENIG -Electroless Nickle/Immersion Gold - RoHS(Thick of Au >5 u")Immersion Silver - RoHS Immersion Tin - RoHS OSP -Organic Solderability Preservatives - RoHS |
Surface/Hole plating thickness | 20-30um |
Board thickness tolerance | +/-0.1mm ~ +/-10% |
Board size tolerance | +/-0.1mm~+/-0.3mm |
PTH hole size tolerance | +/-.003"(+/-0.08mm)~+/-.006"(+/-0.15mm) |
NPTH hole size tolerance | +/-.002"(+/-0.05mm) |
Copper thickness tolerance | +0um+20um |
SM tolerance(LPI) | .003"(0.075mm) |
Impedance tolerance | +/-5%~+/-10% |
SMD Pitch | 0.2mm(8mil) |
BGA Pitch | 0.2mm(8mil) |
Aspect Ratio(hole size: board thickness) | 1:10 |
Chamfer of Gold Fingers | 20, 30, 45, 60 |
Test | 10V-250V, flying probe or testing fixture |
Others Techniques |
Gold fingers Blind/Buried hole peelable solder mask Edge plating Carbon Mask Kapton tape Countersink/counterbore hole Half-cutted/Castellated hole Press fit hole Via tented/covered with resin Via plugged/filled with resin Via in pad |
Last update time: | Apr 02, 2015 |
Add: No. 1369, Chengnan Rd, Jiaxing,314001
Zhejiang, China
Phone: +86- 13967312812
Email: sales@apcboard.com